HLK-RM20 HLK-RM20 --EngrWorld

HLK-RM20 is a high-performance embedded module launched by Hi-link Electronics, which is a highly integrated on-chip system routerdevice module, using MT7981B+MT7531A solution, for home entertainment and home automation, etc.

The SoC used is manufactured using advanced silicon technology and integrates dual core ARM ® Cortex-A53MPCoreTM， work

Up to 1.3GHz frequency and more DRAM bandwidth. It also includes various peripherals, including SGMII and USB3.0 (host)

Port. Two 2.5Gbps HSGMII Ethernet interfaces have also been implemented.

The built-in hardware based NAT engine with QoS in HLK-RM20 not only has good connectivity, but alsoTransferring audio and video streams at a higher priority than other non time sensitive services enriches home entertainment applications. SFQ connects P2P sessions

Separate from audio and video sessions to ensure streaming services for HLK-RM20. With advanced technology and rich features,

HLK-RM20 will become the core of the next generation intelligent home gateway system.

Product Features

Nand Flash/DDR3 ;
Interface WAN * 1 LAN*5、USB3.0、PCIe Gen2 1-Lane x 1;
WAN access methods include PPPoE, dynamic IP, static IP, 3G/4G/5G;
Static address allocation, virtual server, port forwarding DMZ host;
Module power supply voltage: DC3.3V5A;
Key features embedded dual core ARM ® Cortex-A53 MPCore 1.3GHz

-32KBL1 I-Cache and 32KBL1 D-Cache

-256KB Unified L2 Cache

-NEON/FPU

HLK-RM20 Diagram 拷贝

Technical Specifications

Module	Mode	HLK-RM20
Hardware parameters	Storage	DDR3: 256M(2Gbit); Nand Flash: 256M(2Gbit)
	Hardware interfaces	USB，SPI, I2C, UART Lite, JTAG, MDC, MDIO, GPIO, PWM，PCM
	network port	Gigabit network ports6:WAN1、LAN*5
	Partial foot reuse	USB3.0*
	Partial foot reuse	2.5G SGMII*1
	Working voltage	3.3V
	Working current	700mA@3.3（Suggest 3.3V power supply capacity of 3A or above）
	IO drive capability	Max：12ma
	Operation temperature	-20℃~80℃
	Module size	63*58mm
	Storage environment	Temperature: -40~+85 ℃, relative humidity: 5% -90% RH (non condensing)
Software parameters	Firmware upgrade	Web page upgrade, command port upgrade
	Network protocol	IPv4, TCP/UDP
	Software environment	Openwrt
	User configuration	Web configuration

PINS INTRODUCTION 拷贝

HLK-RM20 application 拷贝

	类型	描述
	产品类型	以太网模块
	制造商	Shenzhen Hi-Link
	厂牌	Hi-Link
	通用封装	单排母座 * 2
	协议	IPv4, TCP/UDP
	天线形式	STA/AP/AP Client
	接口	UART/GPIO/PWM/SPI/I2C/USB
	工作电流	700mA@3.3V（建议供电≥3A）
	工作电压	3.3V
	工作温度	-20℃~+80℃
	长宽高	63584

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